Southbridge Amd 218s7ebla12fg Sb700 – Nuevo – Con Bolas
南桥AMD 218s7ebla12fg Sb700 – 新 – 康博拉斯
全新物品,未使用、未开封、未完善且在原包装中,可直接焊接。
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球栅阵列 CHIPSET OBSERVE PRECAUTIONS FOR HANDLING BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls. Lead-free/No Pb BGA chips: 245℃-260℃(Maximun) Leaded/Pb BGA chips: 180℃-205℃(Maximun) |
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